Adhesiveless Copperclad Polyimide Film

Copper is laminated without an adhesive on the insulator film. - This is the most simply-composed material among flexible electronics materials.
Nevertheless, advanced metallizing technology is concentrated in this product, and the high quality characteristics that are required for LCD panel COFs are realized.

• Fine patterning : A thin and even copper layer is optimal for high-precision processing.
• High reliability : High adhesion and excellent electrical isolation are realized.
• High durability against bending : High durability is realized through our unique plating technology.