Calibre for 3D-IC Sign Off

Calibre—the leading platform for IC physical verification, extraction, LVS and DFM—meets the needs of designers building 3D-IC products today, whether they are based on SiP, silicon interposers or stacked die with TSVs.

The Calibre solution integrates seamlessly with current design flows and design styles, providing the ability to verify the design of multi-die stacks based on separately verified die. Using these techniques, designers can create mixed process systems-on-chip with higher density, lower power, and greater bandwidth—all without disruption to their existing flows.